What We Offer
CCRAFT delivers end-to-end TFLN foundry services:
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Industrial-grade monolithic TFLN PIC platform with several key technological steps including TFLN etching, metallization layers, cladding, and back end of line (BEOL) processes.
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Process Design Kit (PDK) tested in several development cycles with ongoing improvement enriching the component libraries.
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MPW services for early-stage innovation and rapid prototyping.
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Custom RUNs for dedicated developments and qualifications.
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Scalable wafer fabrication for high-volume production.
Collaboration with CSEM
CSEM, as our R&D house continues to enhance the integrated photonic platforms through process innovation, device integration, and collaborative R&D.
This close collaboration ensures that every chip benefits from the latest innovations and the rigor of Swiss engineering.
Why TFLN Matters
Thin-Film Lithium Niobate is transforming the photonics landscape with unmatched performance and versatility:
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Ultra-high data rates to meet the demands of the AI era.
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Lower power consumption for sustainable industry growth.
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Performance and cost efficiency through industrial-scale manufacturing.
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Miniaturization that reduces size, weight, and cost.
Our Mission and Vision
Mission: Industrialize next-generation photonic technology and deliver high-performance TFLN PICs to customers worldwide.
Vision: Power the photonics revolution with faster, greener, and more connected systems that shape a sustainable digital future.
Pioneering Industrial-scale TFLN Photonics
CCRAFT is the world’s first industrial-scale Thin-Film Lithium Niobate (TFLN) photonic integrated circuit (PIC) foundry.
Spun out from CSEM’s pioneering R&D, we bring cutting-edge TFLN technology from the lab to high-volume production — enabling faster, greener, and more scalable photonic systems for communications, quantum, AI, sensing, and beyond.
Our Story & Roots in Innovation
Our journey began at CSEM, where over six years of intensive research and process development resulted in one of the world’s most advanced industrial-grade TFLN PIC platforms.
Through pilot production, CSEM delivered thousands of high-performance chips to over 40 partners worldwide, validating the platform’s reliability and scalability.
In 2025, CCRAFT was launched as a spin-off to scale up manufacturing capacity and serve global markets, while CSEM continues to advance the platform through research collaborations, new device integration, and system demonstrators.
