Delivering Innovation from Prototype to Production
At CCRAFT, we operate our own state-of-the-art fabrication facility, giving us full control over the manufacturing process. This enables us to deliver exceptional quality, flexibility, and speed, from early-stage prototyping to high-volume production. We are already shipping TFLN-based photonic chips to customers and are scaling up to meet growing industry demand.
Our focus is twofold:
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Advancing TFLN as the platform for next-generation integrated photonics
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Supporting the silicon photonics ecosystem through scalable heterogeneous integration
To ensure a smooth path to deployment, our designs are developed with packaging compatibility in mind, and we offer extensive design support to help you achieve optimal performance.
Our Solutions
Monolithic TFLN Chips
Fabricated on lithium niobate on insulator (LNOI) substrates using up to 10 main advanced process steps for full photonic integration.
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TFLN Chiplets
Chiplets compatible with micro-transfer printing, enabling cost-effective, customizable, and scalable heterogeneous integration.
TFLN-Enhanced Wafer Processing
TFLN micromachining services to support fabs and platform developers looking to integrate TFLN into their workflows.
We Offer
Multi-Project Wafer (MPW)
Ideal for: Prototyping, research, early-stage validation
Volume: Shared wafer access
Cost: Entry-level, $/mm²
We offer MPW services based on our standardized TFLN platform and the process design kit (PDK). Customers can access high-performance photonic technology at low cost by sharing wafer area, perfect for proof-of-concept designs or academic projects.
Run ID / Technology
2501 / CLN600-Core
2502 / CLN600-Plus
Design Due Date
30 September 2025
14 December 2025
Status
Accepting Designs
Accepting Designs
MPW Runs Schedule
* Participation is limited — early registration is strongly recommended.
Custom Dedicated Wafer Runs
Ideal for: Pre-production, product integration, process qualification
Volume: Dedicated wafers, minimum order 4 wafers
Cost: Scales per wafer or per chip based on order size
When your design requires more space, flexibility, or tailored process steps, or you deliver to niche markets, we offer dedicated wafer runs on our industrial-grade TFLN platform. Custom runs give you full control over layout, design integration, and fabrication parameters — enabling you to fine-tune your product or system before moving to scale.
This option is also ideal for qualification and validation prior to high-volume production, helping de-risk your transition from prototyping to manufacturing.
High-Volume Manufacturing
Ideal for: Product deployment and commercialization
Volume: 100s to 20,000 wafers per year
Cost: Scales with volume and production commitments
We provide a clear path to industrial-scale manufacturing. Our high-volume TFLN PIC production is backed by yield-optimized processes, stable quality control, and a roadmap that supports 8-inch wafer manufacturing.
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Capacity ramp-up through 2026–2028
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Dedicated production tools and infrastructure
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Integration support for packaging and system-level alignment
Specialty Process Services on TFLN and Related Materials
Ideal for: Platform developers, foundries, and R&D partners
Volume: From 4 wafers and up
Cost: Project-based, depends on process steps and volume
We offer targeted fabrication services for customers needing specific processing steps on TFLN and similar materials. This includes etching, metal deposition, oxide deposition, and periodic poling, tailored primarily for integrated photonic applications.
We support both prototype-level engagements and scalable volume production, acting as a flexible and collaborative partner throughout the development cycle.
Our Process Design Kit (PDK)
C-band (1550 nm)
Qualified Version - Tested through several runs
Feedback accumulated from customers and partners
Maintenance is ongoing, adding new building blocks
O-band (1310 nm)
Version Alpha - Under test
Launching the Beta version in 2026
Quantum & visible bands (500nm-900nm)
Version Alpha - Under test
Launching the Beta version in 2026
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Regular process control and PDK maintenance conducted
in our in-house cleanroom and characterization lab