Advanced TFLN Photonic Chip Manufacturing Technology

Our Expertise in Cutting-Edge Manufacturing

Our state-of-the-art proprietary technology is designed to cater to both fabless companies, which are early adopters of next-generation photonic chips, and conventional silicon photonic foundries looking to enhance their platforms by integrating TFLN. It encompasses a range of advanced manufacturing capabilities, including:

Precision TFLN Micromachining
Multilayer Metallization
Cladding and Layer Openings
Device-layer undercut

These processes allow for the realization of various on-chip components and functionalities:

Electro-Optic Modulators for fast communication.
CMOS Compatibility for easy integration.
Low-Loss Fiber Coupling for reliable connectivity.
Frequency Conversion via PPLN for spectroscopy, optical and quantum computations.
Acousto-Optic Modulation for dynamic light control.
Efficient interfacing for hybrid and heterogeneous integration with Silicon Photonics.

Driving Forces Behind Next-Generation Photonic Integrated Circuits

High Bandwidth

Supporting AI, HPC, 5G/6G, and cloud computing with ultra-fast, energy-efficient interconnects and data rates beyond 400 Gbit/s.

Large-Scale Integration

Compact, low-loss solutions with heterogeneous integration, photonic-electronic co-integration, and programmable PICs.

Low Power Consumption

Efficient systems with CMOS-level voltage operation and low-loss waveguides, versatile packaging, and minimal thermal effects.

Wide Wavelength Range

Expanding optical data links and enabling quantum computing, biosensing, and spectroscopy.

New Functionalities

Advanced features like on-chip wavelength conversion, isolators, and ultra-fast photodetectors.

TFLN: A Versatile PIC Platform for the Future

High Nonlinearity

Exceptional for efficient modulation and wavelength conversion.

Robustness and Reliability

Proven telecom material for decades, ensuring durability in harsh environments with scalable integration.

Low Optical Loss

Enables large-scale on-chip circuits, delay lines, and minimizes the need for optical amplifiers.

Compact Footprint

Ensuring large number of components per chip area, delivers high performance in a miniaturized format.

Wide Transparency

Operates across a broad wavelength range, supporting telecom, quantum, and more.

Piezoelectric Effect

Supports photon-phonon interactions and enables various transducer applications.

Empowering PIC Designers with PDKs

We provide standardized Process Design Kits (PDKs) that streamline product development for photonic integrated circuit (PIC) designers, enabling faster design processes and comprehensive sanity checks. Our expertise guides designers through each stage of the chip design process. Additionally, our PDKs are continuously improved through regular updates, enhancing their reliability and functionality for future designs.